According to a disclosure issued on the 16th via its official channels, Boyuan Alloy stated that its specialized copper compounds are being distributed through downstream manufacturers to support NVIDIA’s newly ramped Vera Rubin architecture. Company secretary Wang Yongsheng specified that the firm provides Boway 19920 for high-speed backplane connectors and PWHC985 high-purity oxygen-free copper for thermal management applications.
The manufacturer emphasized that its PWHC985 alloy has resolved persistent industry challenges regarding blistering and leakage in liquid cooling plates. Consequently, Cooler Master has forecast an annual requirement of 20,000 metric tons, which is currently transitioning into mass production. All output will be manufactured at Boyuan’s new materials facility in Vietnam, where the company’s copper formulations have also secured technical approval from additional overseas thermal solution providers.
This supply chain integration highlights accelerating demand for precision copper alloys engineered specifically for next-generation data center cooling systems. As artificial intelligence infrastructure continues to scale, validated domestic producers securing placements within global technology OEM networks are positioned to capture expanding margins in high-value specialty copper segments.